This website uses cookies to ensure a fast and technically flawless internet presence, to analyze website usage and to support marketing measures. By clicking "Accept all" you agree to the use of these cookies.
Privacy policy
✕

Cookie settings

Choose which tracking and analysis tools should be activated on our websites.
For more information, please see our Privacy Policy.

We use this data to improve our websites and services. We may share encrypted customer information with partners such as Facebook or Google in order to show you relevant advertising and content.

We collect your interactions to provide you with relevant product information. This data may be shared with third parties to enable targeted advertising and to measure the effectiveness of our campaigns.Nous

We customise content based on your interests and shopping habits.

This data helps us to improve your experience, avoid errors and test new functions.

These cookies ensure the function and availability of the website and our services. They are required for use and cannot be deselected.

MiniSKiiP® modules from Vincotech with new die attach technology

An important feature expected from power modules today is longer operating time at high temperatures. Vincotech successfully meets this challenge and achieves up to ten times longer lifetime with the new die-attach technology for their modules.

With the Mitsubishi IGBT  M7 and the latest generation Infineon IGBT7 chips, greater efficiency and power density are also achieved, further reducing system costs in flexible and scalable inverter designs with rated currents from 5 A to 200 A, for example.

Also published in: Polyscope No. 19 / 2020.

Go back