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Mitsubishi LV100 and HV100 - housings with 7th chip generation available

Mitsubishi optimizes its power modules: The new package technology reduces internal inductances to a minimum (10 nH). The IGBT modules are suitable for railroad applications with insulation voltages of 6kV and 10kV (VCES: 1700V, 3300V, 4500V, 6500V) and for industrial applications with insulation voltages of 4kV (VCES: 1200V, 1700V). They are also available as SiC- modules.

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Thanks to the optimized arrangement of the connections, it is easy to set up parallel connection and more flexible inverter configurations with multiple modules. In addition to improved thermal resistance due to the MCB (metal casting direct bonding) baseplate, the modules also feature higher resistance to humid environments.

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Also published in: Polyscope No. 07 / 2021

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image of Philippe Muller

Philippe Muller

Electronics Sales Manager contact

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