SiC MOSFET half and H-bridge power modules from Vincotech

The new flowDUAL SiC E1 and fastPACK SiC E1/E2 have been developed with the aim of making charging stations faster, smaller and more efficient. The modules are based on the latest 650V and 1200V SiC MOSFET chip generations with an RDS(on) of only 5mOhm. In addition to optimizing performance, Vincotech places great emphasis on reliability. With the new advanced die attach technology, these new modules can extend the power cycling lifetime by a factor of 2.

Other advantages

    • Multi-sourced SiC components for more choice and less supply chain risk ­
    • Optional integrated capacitors for improved EMC performance ­
    • Press-fit pins and pre-applied thermal paste to reduce production costs
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The modular system allows you to select the level of integration suitable for the respective application. You decide whether a DC-DC power supply or a gate driver module is sufficient or whether you need a ready-made gate driver unit. Our experts will be happy to assist you in selecting and assembling the optimum components. From now on you can order samples without obligation from our Swiss warehouse!

image of Philippe Muller

Philippe Muller

Electronics Sales Manager contact

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